XZT Electronics Limited is a one-stop EMS supplier integrating PCB design, PCB manufacturing, Component sourcing and PCB assembly.
R&D Capability
XZT Electronics has professional engineering designers and experienced development engineers. With many years of R&D experience in the fields of circuit design and electronic product development, we can efficiently complete design projects according to customer’s needs.
After 17 years of growth, XZT Electronics has not only attracted many outstanding R&D engineers in the industry, but also constantly updated production equipment and developed new production processes. Meanwhile, with three bases, Shenzhen Xili Headquarters, Shenzhen Songgang Factory, and Dongguan Houjie Factory, XZT is endowed with capabilities to support customers from PCB design, PCB manufacturing to PCB assembly.
Maximum signal processing rate: 56Gbps Differential signal |
Designing for Board Level EMC |
Maximum Layer: 32L |
CE、FCC Certification |
Minimum BGA pitch: 0.4mm |
RF Design and analysis |
Minimum Trace Width/Space: 2.5/2.5mil |
HDI Design |
Minimum Hole Dimension: 3mil |
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Maximum Number of Connection: 50000 |
DFX Design: DFM、DFA、DFT、DFC |
Maximum pin quantity: 60000 |
FPC Design:20L Rigid-flex PCB |
Maximum number of BGA: 45 |
Signal integrity design |
Maximum number of BGA Chip pins: 4094 |
Power integrity design |
Wireless Products
GPS, Base Station, Network Optimization, Wi-Fi Module, Microwave System
Multimedia Products
Set-top box、VOIP、Meeting TV,Video capture equipment, etc.
PC and related
MB、NB、Server motherboards and various industrial control boards, etc.
Consumer Products
HD TV, Tablet Computer, Digital Camera, Camcorder, Mobile Phone, etc.
Security Products
Video surveillance equipment, walkie-talkies, etc.
Military Industry and Aerospace
Black box, radar, remote sensing, telemetry, etc.
Communication Products
Routers, switches, wireless terminals, optical networks, gateways, etc.
Medical Equipment
Ultrasound, CT, MRI, Monitor, etc.
Design field